TDK Semiconductor Corp. Introduces First Complete System On a Chip for EMV Smart Card Terminals; Company Uses Mixed-Signal Expertise to Expand into New Business Arena
TUSTIN, Calif.--(BUSINESS WIRE)--Jan. 27, 2003--TDK Semiconductor
Corp. today announced the availability of a new smart card terminal
controller.
The 73S1121F is said to be the first true system on a chip for
smart card terminals. This new low-cost device integrates all the
functionality for implementing a complete range of smart card
terminals for network access security, e-purse terminals, payphones,
vending machines, and inexpensive POS terminal applications.
The 73S1121F includes an 8052 processor, a USB interface, two
built-in smart card interfaces with a dedicated hardware ISO7816 UART,
multiple development software layers, extensive I/Os, 64KB of Flash,
4KB of user-RAM, a PIN pad interface, and more on a single chip. This
solution will significantly reduce cost and component count for
implementing smart card terminals.
"We believe this represents the first complete implementation of a
third-generation smart card terminal controller," said J. Christophe
Doucet, product manager.
"First generation systems developed in the mid-90s are separate
smart card interface chips connected to a host microcontroller with
protocol processing handled through software. Second generation
versions are single-chip systems, but include relatively few I/O
interfaces, not much memory, and limited capabilities overall. Our
73S1121F smart card terminal controller includes all the capabilities
required for a terminal designer to develop products that can be used
in standalone mode or directly attached to a higher-level controller
or PC."
Doucet noted that TDK Semiconductor's single-chip modems and
Ethernet transceivers are already widely used in smart card reader
applications. "Our new controller will allow us to offer a broader
range of solutions in the smart card terminal marketplace," he added.
Software Levels
The 73S1121F is designed to ease and expedite a company's entry
into the smart card terminal business. A low level Application
Programming Interface (API) is provided for device control and a high
level API includes protocol layers for both asynchronous cards and
full-speed USB, plus PIN-management functions for security and payment
applications.
Smart Card Interfaces
The 73S1121F has two built-in ISO7816/EMV smart card interfaces
which could be used, for example, to simultaneously connect to a user
card and to a Secure Application Module (SAM) for applications such as
electronic transactions, e-purse or physical and logical access. The
device can be expanded externally to support additional interfaces.
Dedicated Features
On-chip hardware support for a real-time clock is also provided
for synchronous cryptographic applications, for example. The chip
incorporates an intelligent 5x6 keyboard interface, a USB port, and
additional I/Os to connect an external LCD driver. A serial interface
allows connection to a PC, to another controller or even to a modem
chip such as the 73M2901CL, a TDK Semiconductor low-speed single-chip
modem widely used in transaction terminal applications. Also included
are several analog inputs, reserved user I/O lines, and a GPIO port
for connections that require higher voltages than the chip's normal
2.7V to 3.6V range.
Approval Support
TDK Semiconductor offers to help customers through the EMV 2000
Level 1 (EuroPay/MasterCard/Visa) smart card terminal type approval,
and provides testing application software. 73S1121F customers will
also receive a USB driver sample compatible with the Microsoft(R)
Windows(TM) Hardware Quality Laboratory test suite. Support in
obtaining approvals is a service which TDK Semiconductor already
provides to customers of its modems, Ethernet transceivers and other
mixed-signal products.
Availability
73S1121F will be priced at less than $9 in quantity. Samples are
available now and production quantities will be available in June.
About TDK Semiconductor Corp.
TDK Semiconductor, part of $4.8 billion TDK Corp. (NYSE:TDK),
provides advanced ICs for communications markets worldwide. The
company produces analog and mixed-signal products for applications
such as digital cable and satellite set-top boxes; local, metro and
wide area networking; point-of-sale terminals, payphones, meters and
smart card readers.
Additional product information and the name of a local TDK
representative can be obtained by visiting the company's Web site at
http://www.tdksemiconductor.com, sending an e-mail to
support@tdksemiconductor or by calling 714/508-8800.
Note to Editors: High-resolution images can be downloaded from:
http://www.tdksemiconductor.com/news/pressroom.cfm.
EZ/np
CONTACT: TDK Semiconductor Corp., Tustin
Rebecca Bueno (editorial), 714/508-8864
E-mail: rebecca.bueno@tdksemiconductor.com
